| Customization: | Available |
|---|---|
| Condition: | New and Used |
| Speed: | High Speed |
|
Still deciding? Get samples of US$ 73000/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
The MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen printing. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 is configured with a 10M pixel or the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightening fast inspection rates. The MS-11 uses the same robust platform as MIRTEC's MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.
Feature:
| Model | MS-11 | ||
| PCB Size Range | |||
| Single Stage Conveyor | Single Lane | 50x50~510x510mm | |
| Dual Lane | 50x50~510x590 mm[Single]/50x50~510x300mm[Dual] | ||
| Triple Stage Conveyor [Option] | Single Lane | 50×50~330×510 mm/50×50~510×510mm | |
| Inspection Capability | |||
| 6 μm | 0201 [mm]Solder Paste| ±2 mm Warpage | ||
| 10 μm | 0402 [mm]Solder Paste| ±3 mm Warpage | ||
| 15 μm | 0603 [mm]Solder Paste| ±5 mm Warpage | ||
| 20 μm | 0805 [mm]Solder Paste | ±6 mm Warpage | ||
| Inspection Technology | |||
| 3D Inspection Technology | Shadow Free -Moiré 3D Phase Step Image Processing | ||
| Height Resolution | 0.1 μm | ||
| Height Accuracy | On a Calibration Jig | ±1% | |
| Height Repeatability | On a Calibration Jig | ±0.5 μm | |
| Volume Repeatability | On a Calibration Jig | ±2% | |
| Solder Height | Maximum | 600 μm [Option:650 μm] | |
| Minimum | 40 μm | ||
| Inspection Speed | |||
| 25 Megapixel Camera | CoaXPress | 6μm | 1800 mm²/Sec |
| 15 Megapixel Camera | CoaXPress | 10 μm | 3,000 mm²/Sec |
| 15 μm | 6600 mm²/Sec | ||
| 4 Megapixel Camera | Camera Link | 10 μm | 1,500 mm²/Sec |
| 15 μm | 3,400 mm²/Sec | ||
| 20 μm | 6,000 mm²/Sec | ||
| System Specification | |||
| Snftware | Standard | Built-in SPC,Built-in Repair,GERBER PAD | |
| Option | RMS,RRS,IRS,OLTT,Remote SPC,ePM-SPI | ||
| PCB Top Side Clearance | 20 mm | ||
| PCB Bottom Side Clearance | 50 mm | ||
| PCB Thickness | 0.5 mm~5 mm | ||
| Maximum PCB Weight | 4 kg | ||
| Robot Positioning System | X/Y Axis | Seryo Motor System | |
| Power Requirements | Single Phase[s]200~240V50~6OHz,1.1 kW | ||
| Air Requirements | 5 Kgf /cm²[0.5 MPa],5 LPM | ||
| Dimension and Weight | |||
| Dimension | Machine | 1,080[W]x1,470[D]x1,610[H]mm | |
| Width [Machine G Conveyor] |
Single Stage Conveyor | 1,110 mm | |
| Triple Stage Conveyor | 1,270 mm[S size PCB]/1,630 mm[M size PCB] | ||
| Weight | Single Lane | Approx.950 kg | |
| Dual Lane | Approx.1,000 kg | ||
){kind=link}