| Customization: | Available |
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| Condition: | New |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
GKG G9+ SMT Solder Paste Printer
G9+ is high accuracy and high stability of the fully automatic printing machine vision,GKG followed in SMT industry is the development trend of production of a new generation of fully automatic printing machine with the international leading technology synchronous vision, visual processing of high resolution, high precision of the transmission system, suspension adaptive scraper.
Feature
1.GKG-G9+ automatic solder paste printing machine is a new product aimed at high-end SMT applications, which can perfectly meet the process requirements of 03015, 0.25pich and other fine pitch, high precision and high speed.
2.CCD digital camera system: Brand-new optical path system-uniform ring light and high-brightness coaxial light, together with the brightness function that can be adjusted steplessly, makes all types of Mark points can be well recognized (including uneven Mark points) and is suitable for plating Tin, copper plating, gold plating, HASL, FPC and other types of PCBs with different colors.
3.High-precision PCB thickness adjustment jacking platform: The structure is compact and reliable, the lifting is stable, and the height of the PIN needle is automatically adjusted by software, which can realize the adjustment of the position and height of PCB boards with different thicknesses.
4.Rail positioning system: Utility model invention patent. The detachable and programmable flexible side clamping device can flatten the top of the soft board and warped PCB. Through software programming, it can automatically expand and contract without affecting the tin thickness.
5.Brand new scraper structure design: Through the new scraper structure of the slide rail and the cylinder, the operation stability is improved and the service life is extended.
6.High-speed stencil cleaning: The dripping cleaning structure effectively prevents the cleaning from being unclean due to local lack of solvent caused by the plugging of the solvent pipe.
7.New multi-function interface: Concise and clear, easy to operate. Real-time temperature remote control function.
| Model | G9+ |
| Maximum board size | 450*340mm |
| Minimum board size | 50*50mm |
| Board thickness | 0.4~6mm |
| Maximum board weight | 3Kg |
| Board edge clearance | 2.5mm |
| Board height | 15mm |
| Transport height | 900±40mm |
| Transport speed | 1500mm/s(Max)Program Control |
| Transport direction | One stage |
| Board clamp | Plandover the top damping |
| Side clamping | |
| Adsorption function | |
| Support System | Magnetic Pin |
| Support Block | |
| Manual up-down table | |
| Printing Snap-off | 0-20mm |
| Print Mode | One/Twice |
| queegee Type | bber/Steel Squeegee Blade(angle 45/55/60) |
| Print Speed | 10~200mm/sec |
| Print Pressure | 0.5~10Kg |
| The template frame size | 470*370mm~737*737mm(20mm ~ 40mm) |
| Cleaning System | Drops of rain type cleaning system |
| Reinforced Vacuum absorption | |
| Dry, Wet Vacuum three modes | |
| Back and forth cleaning | |
| CCD FOV | 10*8mm |
| Fiducial mark types | Standard shape datum, custom images |
| Pad | |
| Hole | |
| Camera System | Look up/down optics structure |
| CCDdigital camera | |
| Geometry pattem match | |
| Repeat PostionAccuray | ±12.5um@6σ,CPK≥2.0 |
| Print Accuracy | ±18um@6σ,CPK≥2.0 |
| Based on the third party test system(CTQ)Verify the actual solder paste printingposition repeat precision | |
| Printing cycle | < 7.5sec |
| Power Source | AC:220±10% ,50/60HZ,2.5KW |
| Air Pressure | 4~6 Kgf/cm2 |
| Air Consumption | About 5L/min |
| Operating Temperature | -20C~+45C |
| Operating Humidity | 30%~60% |
| Machine dimensions | 1530(H)×1172(L)×1385(W)mm |
| Machine Weight | Approx:1000Kg |
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