| Customization: | Available |
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| Condition: | New |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
GKG GT++ SMT Solder Paste Printer
Features:
1. GKG dedicated manual adjustment pre-lift platform: simple and reliable structure, low cost, convenient manual adjustment, can quickly realize the adjustment of the PIN pin jacking height of PCB boards with different thicknesses.
2. Image and optical path system: The uniform ring light and high-brightness coaxial light of the brand-new optical path system, together with the brightness function that can be adjusted steplessly, make all types of Mark points can be well recognized (including uneven ones) Mark point), suitable for tin-plated, copper-plated, gold-plated, HASL, FPC and other types of PCBs of different colors.
3. Scraper system: Slide rail type scraper system, which improves the running stability and long service life.
4. Cleaning system: The new type of wiping rubber strip ensures full contact with the stencil, increases the vacuum suction to ensure that the residual solder paste in the mesh is vigorously eliminated, and truly realizes the effective automatic cleaning function, three cleaning modes of dry and wet vacuum , the software can set the cleaning mode and cleaning paper length at will.
| Model | GT++ |
| Max PCB Size | 510x510mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 23mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| PCB positioning (support method) | Magnetic pin/support block/auto up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping | |
| Adsorption function | |
| Print snap-off | 0-20mm |
| Print mode | one/twice |
| Print Speed | 10-200mm/sec |
| Print Mode | One /Twice |
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
| Cleaning System | Droops of rain type cleaning system |
| Dry, wet vacuum three modes | |
| Back and forth cleaning | |
| CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad | |
| Hole | |
| Camera system | Look up/down optics structure |
| CCD digital camera | |
| Geometry pattern match | |
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
| Print accuracy | ±18um@6,CPK≥2.0 |
| Print cycle time | <7.5 sec |
| Power supply | AC:220±10%,50/60HZ, 3.0KW |
| Air pressure | 4~6 kgf/cm² |
| Air consumption | around 5L/min |
| Operating temperature | -20ºC~+45ºC |
| Operating humidity | 30%~60% |
| Machine Dimensions (without tower light) |
1,240(L) x 1,410(W) x 1,500 (H)mm |
| Machine Weight | Approx:1100Kg |
| Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision | |
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