Customization: | Available |
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Condition: | New |
Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
GDK NEO SMT Solder Paste Printer
The structure of NEO is simple and reliable,accurate positioning and easy to adjust, aimed at high end application of SMT, especially for LED mini. It can quickly achieve different thickness of the PCB board PIN pin height adjustment of the automatic adjustment. The spray nozzle makes the cleaning liquid evenly sprinkled on the wiping paper, and the arc-shaped rubber wipe board is soft, antiwear and antirust, clean thoroughly bidirectionally, and can be used for dry cleaning, wet wiping, wet cleaning, reciprocating cleaning and other functions..
Alignment precision∶±10.0micron/μm@6σ,Cp≥2.0
Printing precision∶ ±15.0micron/μm@6σ,Cp≥2.0
Model | GDK NEO |
PCB Parameter | |
Max. board size(X x Y) | 650mm x 610mm |
Min. board size(X x Y) | 50mm x 50mm |
PCB thickness Range | 0.4mm~6mm |
PCB Warpage | ≤1%Diagonal |
Max. board weight | 5Kg |
PCB edge clearance | Configuration to 3mm |
PCB bottom clearance | 20mm |
Conveyor speed ( Max.) | 1500mm/s(Max) |
Conveyor height | 900±40mm |
Conveyor direction | L-R,R-L,L-L,R-R |
Transfer mode | One stage orbit |
PCB damping method | Proarammable flexible side pressure+ Adaptive PCB board thickness+ Edge lock base clamp. (optional: 1,Multipoint partial vacuum at the bottom; 2,Edge locking and substrate clamping) |
Support method | Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity; 2.special workpiece fixture) |
Printing parameters | |
Print head | Servo motrdrives prerisionscrew diven suspendedinteliet printing head two independent diret motos |
Stencil frame size | 470x200~800x800 mm |
Max. printing area(X x Y) | 650x610mm |
Squeegee Material / Angle | Steel squeegee/ Rubber squeegee(Angle 45°/50°/60° matching the printing process) |
Squeegee length | 650mm (optional with length of 200mm-650mm) |
Squeegee height | 65±1mm |
Squeegee thickness | 0.25mm Diamond-like carbon coating |
Print mode | Single or double squeegee printing |
Demoulding length | 0.02-12 mm |
Print speed | 0 ~ 200 mm/s |
Print pressure | 0.5kg - 10Kg |
Print stroke | ±275 mm(From the center) |
Cleaning parameters | |
Cleaning system | 1,front-mounted programmable cleaning liquid injection system;2,dry, wet,vacuum three modes |
Length of cleaning and wiping plate | 650mm |
Optical System | |
Field of view | 8x6mm |
Printing table adjustment range | X:±7.0mm,Y:±8.0mm,θ:±2.0° |
Fiducial Types | Standard Fiducial type ( Circle, triangle, square, diamond, cross) (SMEMA standard),solder pad/openings |
Vision methodology | Independent camera,upwards/downwards imaging vision system, geometric matching location |
Performance parameters | |
Machine Alignment repeatability | ±10.0μm @6 σ,Cpk ≥ 2.0 |
Full process repeatability | ±15.0μm @6 σ,Cpk ≥ 2.0 |
Core Cycle time | 7.5s(Exclude printing and cleaning) |
Product changeover time | <5min |
Equipment | |
Power supply | AC220V±10%,50/60HZ,15A |
Air supply | 4~6Kg/cm² |
Gas Consumption | About 5L/min |
Operating system (OS) | Windows 7(Optional WIN10) |
External dimension | 1,540(L) x 1,220(W) x 1,660(H)mm(Without light,monitor and keyboard) |
Machine weight | Appro.1230Kg |
User Permission | Different users have different permissions (fingerprint identification entering / password input) |
Environment temperat | 23±3°C |
Relative humidity | 45~70%RH4 |